Len Nunnery, v-p of Marketing, Worldwide for Bulk Molding Compounds, and the Division Chair of the Society of Plastics Engineers Thermoset Division, has announced that the Division's 2010 Topical Conference (TOPCON) will be held at the Trump International Hotel and Tower in downtown Chicago on April 6-7. 

A highlight of the conference will be a Leadership Panel represented by Tom Merrel, CEO of Industrial Dielectrics; Tom Meola, president of Premix; Mike Huff, COO of Citadel Plastics Holdings/BMCI; Phil Beesley, general manager & president of Durez Canada/Sumitomo Bakelite; and Mike Brotz, CEO of Plastics Engineering Co.  Mr. Nunnery will moderate the session.  Technical papers will also be presented at the TOPCON and discussions focusing on the respective visions and the future of the thermoset plastics industry.  For more on the TOPCON or to register, call 630-247-6733 or send e-mail to shelaneb@earthlink.net.

One of those topical discussions is likely to be on the benefits of certain thermoset materials over certain thermoplastics in critical applications where moisture absorbtion is a concern.  For more information, point to the banner at the top left of this page where Automotive NewsWire sponsor Bulk Molding Compounds offers insight into some important materials that can keep you out of a "sticky situation."  Click the banner now!